ADVANCED OPTICAL SOLUTIONS

WE TURN LIGHT
INTO INFORMATION.

Academic spin-off and deep-tech startup developing photonic and optoelectronic systems for advanced sensing.

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ABOUT US

We work where
research meets engineering.

OptoEncase grew from the research experience of the Micro Nano Sensor Group at the Polytechnic University of Bari. The company was created to bring advanced photonic and optoelectronic expertise closer to real applications.

THE PEOPLE BEHIND OPTOENCASE
Teresa Natale

Teresa Natale

Co-founder & CEO
Francesco Dell’Olio

Francesco Dell’Olio

Co-founder & CTO
Ludovico Dindelli

Ludovico Dindelli

FPGA & Edge AI Specialist

End-to-end engineering
for advanced sensing.

OptoEncase helps companies and R&D teams turn complex photonic and optoelectronic concepts into validated systems. We combine photonic integrated circuits, advanced electronics, embedded firmware, opto-mechanical packaging, and rigorous test methods to reduce integration risk and accelerate the path from requirements to functional prototypes and modules ready for industrial transfer across aerospace, biomedical, industrial, and scientific applications.

Bridging the gap between
R&D and industrial deployment.

Our multidisciplinary, end-to-end approach spans requirements definition, system architecture, co-design, integration, testing, and pre-industrial validation.

SOLUTIONS

Define the signal. Integrate the system. Validate the result.

System Architecture

We translate application needs into measurable requirements and a coherent photonic, electronic and mechanical architecture.

Photonic & Electronic Co-Design

We design optical paths, PICs, readout electronics and control interfaces together, reducing integration risk from the start.

Integration & Prototyping

We assemble optical, electronic, firmware and opto-mechanical elements into functional demonstrators and custom prototypes.

Testing & Validation

We characterize performance, noise, drift and repeatability under relevant operating conditions.

CORE CAPABILITIES

Photonic and electronic co-design

System architecture, PIC and optical subsystem design, readout and control electronics, ASIC specifications, component selection, and interface definition.

Integration and packaging

Fiber-to-chip interfaces, optoelectronic assembly, packaging, and chassis design engineered for thermal stability, mechanical robustness, and repeatable performance.

Prototyping and validation

Technology demonstrators and functional prototypes, performance characterization, noise and drift analysis, test procedures, reliability assessment, and pre-industrial validation.

Firmware and signal processing

Embedded firmware, real-time signal processing, multiphysics modeling, and methods to estimate and mitigate noise, drift, and system non-idealities.